Purpose-Built Power Inductor for Next-Generation Notebook CPUs & GPUs
2025.12.22
New Products
GOTREND
Purpose-Built Power Inductor for Next-Generation Notebook CPUs & GPUs
As notebook CPU and GPU performance continues to accelerate, next-generation BPU (Battery Processing Unit) and VR power architectures face increased demands: faster transient response, lower ripple, higher thermal stability, and extreme space constraints. GOTREND introduces the GSTS5030PC-R15M1 molded power inductor, engineered specifically to address these challenges in modern high-density computing platforms. Built with high-permeability, low-loss carbonyl iron powder and a fully shielded molded structure, the GSTS5030PC-R15M1 delivers outstanding electrical performance within an ultra-compact 5.7×5.2×2.8 mm footprint.
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Key Features
Utilizes carbonyl iron powder for superior current handling: 50A saturation current and 40A RMS current, significantly outperforming competitors for CPU/GPU transient power demands.
• Ultra-Low Loss, Dramatically Enhanced Efficiency:
Ultra-low 0.9mΩ DCR minimizes power loss and heat generation, improves conversion efficiency, and extends battery life and minimizing AC losses in fast-switching systems.
• High Reliability and Operational Stability:
Monolithic molded structure ensures durability; magnetic shielding reduces EMI.
• Compact Design with High Power Density:
Compact 5.7x5.2x2.8mm size saves PCB space, ideal for high-density power designs in notebooks and servers.
• Wide Bandwidth and Broad Application Compatibility:
Leveraging material and structural advantages, it delivers excellent high-frequency performance suitable for high-speed switching power designs and -40℃ to 125℃, suitable for various power topologies and harsh conditions.
Gotrend GTLVRM Series Overview
2. Cross-Strait Inventory Support: Flexible support for urgent demands via warehouses in both Taiwan and China.
2. High-Speed Logistics Network: Ensures efficient global shipping and timeliness.
Main application
• High-performance notebook and ultrabook CPU/GPU power stages
• CPU/GPU VRM
• SSD / HDD / NAS power modules
• High-current DC-DC converters
• Space-constrained computing devices requiring efficient thermal behavior
Dimensional Electrical Specification Comparison Table
|
序号 |
產品料號 |
GOTREND (GSTS系列) |
Tai-Tech( TPMC系列) |
||||||||
|
L ( uH ) |
DCR (mΩ) (+/-10%) |
ACR (mΩ) (Max) |
Isat (A) ( Typ.) |
Irms (A) ( Typ.) |
L ( uH ) |
DCR (mΩ) (Typ.) |
ACR (mΩ) (Max) |
Isat (A) ( Typ.) |
Irms (A) ( Typ.) |
||
|
1 |
GSTS5030PC-R15M1 |
0.15 |
0.9 |
20 |
50 |
40 |
0.15 |
0.9 |
20 |
47 |
36 |
