【GTLVRM Series】 Coupled Inductors to Enhance High-Performance Power Design Efficiency
2025.11.8
New Products
GOTREND
Gotrend Technology Launches GTLVRM Series Coupled Inductors to Enhance High-Performance Power DesignEfficiency
With the rapidly growing demand for higher power efficiency and density in AI computing, servers, and high-endgraphics cards, Gotrend Technology introduces the GTLVRM Series High-Performance Coupled Inductors,specifically engineered for the next-generation multiphase Voltage Regulator Module (VRM) applications. The series adopts a high-permeability composite powder molded structure, achieving both ultra-low DC resistance(DCR) and excellent thermal stability. It delivers superior current handling capability while minimizing power lossand temperature rise—enabling customers to build more efficient, compact, and reliable power solutions.
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Key Features
Specifically designed for coupled-inductor VR (Voltage Regulator) architectures, perfectly supporting PMIC multiphase power designs.
• Advanced Materials:
Constructed with composite powder molding technology, achieving superior combined performance in DCR / Isat / Irms compared to competitors.
• Robust Construction:
One-piece molded structure provides high mechanical strength and reliability, effectively resisting shock and vibration.
• Size Range:
From 7.8×4.8×5.8 mm to 11.0×6.7×4.7 mm, covering multiple design requirements.
• Electrical Performance:
Features low leakage flux and low noise characteristics, offering a wide inductance range and high saturation current capability.
• Operating Frequency:
100 kHz – 1 MHz
• Operating Temperature:
–40 °C to +125 °C
• Reliability Certification:
Passed 13 rigorous reliability tests; quality system complies with IATF 16949 and AEC-Q200 standards.
Gotrend GTLVRM Series Overview
Main application
• PC、Server、IPC、VRM and EVRD
• Data networks and storage systems
• Point-of-load modules (POL)
• AI HPC (High-performance computing)
•Graphics cards, Battery power systems and PMIC control
Dimensional Electrical Specification Comparison Table
|
序号 |
產品料號 |
GOTREND (GTLVRM系列) |
TDK( VLBUC系列) |
VISHAY(IHTL系列) |
||||||||||
|
L1-4 (uH) |
DCR1-4 |
Isat1-4 |
Irms1-4 |
L1-4 (uH) |
DCR1-4 |
Isat1-4 |
Irms1-4 (A) (Typ.) |
L1-4 (uH) |
DCR1-4 |
Isat1-4 |
Irms1-4 (A) (Typ.) |
|||
|
1 |
GTLVRM105010PS-R10M |
0.1 |
0.15 |
125 |
70 |
0.1 |
0.135 |
100 |
70 |
0.1 |
0.125 |
98 |
75 |
|
| 項目 | GTLVRM105010PS-R10M (MOLDING) |
GTLVR966411PVT8-R10L5S (傳統) |
優勢說明 |
| 結構類型 | 一體成形Molding結構 | 傳統鐵氧體組裝結構 | Molding 結構更堅固,抗衝擊性強 |
| 尺寸(mm) | 9.8 x 4.8 x 9.8 | 9.6 × 6.4 × 10.5 | 更緊湊,尤其寬度減少 25%,適合高密度佈局 |
| 電感鎖 | 100 nH. (±20%) | 100 nH (±20%) | 電感範圍相Molding 結構一性更佳 |
| DCR(1-4)(mΩ) | 0.150(Typ.) | 0.125(Typ.) | 略高但仍在低損耗範圍,Molding 結構散熱更優 |
| Isat1-4(A) | 125.0 (Typ.) | 98.0 (Typ.) | 飽和電流提27.5% , 承載能力更強 |
| Irms1-4(A) | 70.0 (Typ.) | 75.0 (Typ.) | 略低但仍在高水準, Molding 結構溫升控制更佳 |
| 結構強度 | 一體成型,抗振動,抗衝擊 | 粉末冶金,結構較脆 | Molding 結構更適合高振動環境 |
| 可靠性測試 | 通過熱衝擊,振動,濕度等多項測試 | 同左,但結構更易受外力損傷 | Molding 結構在嚴苛環境下更可靠 |
